General Information
????? Assistant Professor: July 2019 – present
????? Tel: +91-022-25767647
????? Email: deepook@iitb.ac.in
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Academic Background
- B. Tech. & M. Tech. (Metallurgical Engineering and Materials Science), IIT Bombay, 2013
- M.S. (Materials Science and Engineering), Carnegie Mellon University, 2016
- Ph.D. (Materials Science and Engineering), Carnegie Mellon University, 2018
Professional Experience
- Post Graduate Management Trainee, L&T Special Steels and Heavy Forgings, 20013-14
- Development Specialist, Metals R&D, Praxair Inc., 2018-19
Interests
- Steelmaking and casting
- Refractory interaction with steel and slag
- Additive Manufacturing
- Metal recycling and recovery
Research Interests
- Thermodynamics and Kinetics of Metallurgical Processes
- Mass transport in Pyrometallurgical process
- Inclusion characterization
Selected Publications
- D. Kumar, K.C. Ahlborg, P.C. Pistorius, ‘Development of a Reliable Kinetic Model for Ladle Refining’, Metall and Materi Trans B (2019), https://doi.org/10.1007/s11663-019-01623-y
- D. Kumar, P.C. Pistorius, ‘Rate of MgO Pickup in Alumina Inclusions in Aluminum-Killed Steel’, Metall and Materi Trans B (2019) 50: 181. https://doi.org/10.1007/s11663-018-1436-z
- D. Kumar, N.T. Nuhfer, M.E. Ferreira, P.C. Pistorius, ‘Application of Plasma FIB to Analyze a Single Oxide Inclusion in Steel’, Metall and Materi Trans B (2019) 50: 1124. https://doi.org/10.1007/s11663-019-01555-7
- D. Kumar, P.C. Pistorius, ‘Use of Slag (CaO-Al2O3-SiO2-MgO) Droplet as a Catalyst to Grow MgO Whiskers Through VLS Mechanism’, Ceramics International (2017) 43: 15478. https://doi.org/10.1016/j.ceramint.2017.08.095
- P.C. Pistorius, D. Kumar, Y. Kacar, ‘How and Why Inclusions Change Chemically During Steel Processing’, Proc. Intl. Conf. on Sci. Tech. Ironmaking Steelmaking, Kanpur, 2017, paper 11ANL11KN8
- D. Kumar, N. B. Ballal and S. Basu, “In-situ Alloying During Electroslag Refining of Low Alloy Steel,” Proc. Intl. Conf. on Sci. Tech. Ironmaking Steelmaking, Jamshedpur, 2013, paper SMTO-3.
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